Materials that are firmly bonded together with epoxy and other tough adhesives are ubiquitous in modern life—from crowns on teeth to modern composites used in construction. Yet it has proved remarkably difficult to study how these bonds fracture and fail, and how to make them more resistant to such failures.

Now researchers at MIT have found a way to study these bonding failures directly, revealing the crucial role of moisture in setting the stage for failure. Their findings are published in the journal Proceedings of the National Academy of Science in a paper by MIT professors of civil and environmental engineering Oral Buyukozturk and Markus Buehler; research associate Kurt Broderick of MIT’s Microsystems Technology Laboratories; and doctoral student Denvid Lau, who has since joined the faculty at the City University of Hong Kong.

“The bonding problem is a general problem that is encountered in many disciplines, especially in medicine and dentistry,” says Buyukozturk, whose research has focused on infrastructure, where such problems are also of great importance. “The interface between a base material and epoxy, for example, really controls the properties. If the interface is weak, you lose the entire system.

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