Taking advantage of the force generated by magnetic repulsion, researchers have developed a new technique for measuring the adhesion strength between thin films of materials used in microelectronic devices, photovoltaic cells, and microelectromechanical systems (MEMS).

The fixtureless and noncontact technique, known as the magnetically actuated peel test (MAPT), could help ensure the long-term reliability of electronic devices, and assist designers in improving resistance to thermal and mechanical stresses.

“Devices are becoming smaller and smaller, and we are driving them to higher and higher performance,” says Suresh Sitaraman, a professor at the George W. Woodruff School of Mechanical Engineering at the Georgia Institute of Technology. “This technique would help manufacturers know that their products will meet reliability requirements, and provide designers with the information they need to choose the right materials to meet future design specifications over the lifetimes of devices.”

The research has been supported by the National Science Foundation, and was reported in the March 30, 2012 issue of the journal Thin Solid Films.

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