(Kistler: Switzerland) -- Kistler’s new Types 6162A and 6163A diaphragm sensors allow high-precision measurement of cavity pressure during injection molding and pressing of low-viscosity melts. The sensors are the latest quality assurance tool for processing cross-linking molding compounds and for various low-pressure methods. Kistler will unveil its sensors on Stand 10F04 in Hall 10 during K 2010, the international trade show for plastics and rubber, scheduled for Oct. 27–Nov. 3 in Düsseldorf, Germany.

The main field of application for the sensors is in the production of fiber-reinforced, lightweight plastic structures and composite parts for the automobile and aerospace industries, using conventional and high-pressure resin transfer molding. These sensors can also be used for injection molding and pressing of temperature-resistant components for domestic appliances and electrical products from thermosetting materials such as bulk-molding compounds (BMC) and sheet-molding compounds (SMC), and from elastomers and liquid silicone resin.

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