(Siemens: Plano, TX) -- Siemens Digital Industries Software announces the establishment of JEP181—a neutral file, XML-based standard from the JEDEC Solid State Technology Association, which is the global leader in standards development for the microelectronics industry.

The JEP181 standard simplifies thermal model data sharing between suppliers and end users in a single file format called ECXML (Electronics Cooling eXtensible Markup Language).

The new standard was created to meet a significant challenge for electronics manufacturers: as increasingly powerful processors allow companies to pack more performance and functionality into their designs, the effective management of heat dissipation and other thermal factors has become essential to the successful design of their next-generation electronics products. Advanced electronics cooling simulation technologies enable the creation of highly accurate thermal models of new product designs. But the absence of a uniform format for the exchange of thermal simulation data throughout supply chains has created unnecessary duplication of effort and the potential introduction of errors into the stream.

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