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FlipChip International LLC recently appointed Marcus Crayon vice president of quality for its semiconductor-wafer scale packaging and bumping business in Phoenix.
“We are excited to have Marcus Crayon join FlipChip International as our vice president of quality. His experience in product quality for major global integrated device manufacturers and original equipment manufacturers will bring a new dimension to FCI’s wafer-level packaging products and services,” says Bob Forcier, FlipChip president and CEO. “With Mr. Crayon joining our leadership team, we are confident that we can accelerate our continuous improvement in product performance and reliability expected by our customers in these strategic markets.”Crayon replaces Terry Lubsen, who is retiring after 40 years in the semiconductor industry and will work as a consultant for FlipChip.
“I also want to extend a special thanks to Terry Lubsen for his excellent support of FlipChip and we look forward to Terry assisting in the transition,” Forcier continues.
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