In a certain operation, a part is subject to a high-temperature curing cycle. The ideal curing scan is illustrated in the chart below. The oven chamber begins at room temperature, ramps up to a conditioning temperature of about 80 degrees, dwells for four minutes, ramps up again to the curing temperature of 120 degrees, dwells for five minutes and then cools back to room temperature.To monitor the temperature profile, a thermocouple is placed on the part. There are 11 key temperature readings during the cycle marked on the illustration. There are temperature specifications for each of the key time intervals. The software that controls the oven will generate a hard-copy scan of each curing cycle, but the company wants to use statistical process control (SPC) methods to analyze the 11 key temperature points.

What chart(s) would you recommend in this case?

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