This article describes a novel, integrated micromanufacturing process utilizing a combination of wire electro discharge grinding (WEDG) technology and one-pulse electro discharge (OPED) to fabricate microspherical stylus tips for microcoordinate measuring machines (μCMM). With an optimal selection of parameters, burnished microspherical stylus tips in a variety of diameters can be produced instantaneously. This process is particularly used for production of micro ball-end stylus tips with diameters smaller than 0.1 mm, which are not available using conventional machining processes. With further research into probing systems, μCMM in the near future will be capable of measuring such micrometer-sized products as micro molds, micro die, and micro holes more precisely.

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