(GOEPEL: Jena, Germany) -- GOEPEL electronics LLC’s OptiCon X-Line 3D, an in-line 3-D X-ray inspection system, provides the powerful opportunity to detect voids within various layers of large-volume solder joints. In particular, in the areas of power electronics for wind power, solar electricity, or electro-mobility, the solder quality is highly important for the components’ thermal coupling because high reliability and long service life must be guaranteed by maximum heat dissipation.

To ensure the above requirements are met, the OptiCon X-Line 3D was enhanced to enable an adapted image recording of the reconstruction, layer by layer. The recorded images allow for an automatic detection of voids in each layer, including classification in terms of quality parameters, separately defined for the respective layer. Furthermore, there is the opportunity to survey and evaluate faults by means of the reconstructed images at a subsequent verification station.

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