(Nanovea: Irvine, CA) -- Nanovea has introduced its patent-pending breakthrough method of reliably acquiring yield strength through indentation, which should replace the traditional tensile testing machine for yield strength measurement.

Traditionally, yield strength has been tested by using a tensile testing machine, a large instrument requiring enormous strength to pull apart metal, plastic, and other materials. The yield strength (also known as “yield point”) of a material in engineering or materials science is the point of stress that a material starts to deform plastically. Before reaching the yield point, a material will deform elastically but return to its original shape when stress is removed—a crucial material property for nano- and micro-related materials found in advancing industries such as biomedical, microelectronics, energy, and  others.

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