(Carl Zeiss SMT: Albany, New York; and SEMATECH: Austin, Texas) -- In a potential boost to advance lithography, engineers at SEMATECH and Carl Zeiss SMT have announced the completion of their final design for the next generation photomask registration and overlay metrology system—called PROVE. The successful final system design release is a major milestone within the project. PROVE will allow for the production of more advanced photomasks with substantially improved image-placement accuracy. Double-patterning lithography, in particular, requires tighter image-placement control for photomasks, but the new system will also enhance photomask production in general.

PROVE, developed by a team of more than 40 Carl Zeiss SMT engineers and supported by SEMATECH, ascertains the accuracy of mask pattern alignment, and registration for 32nm half-pitch and beyond photomasks. Double patterning is a technology for enhancing feature density by using standard 193nm wavelength technology. The newly developed metrology technology also forms part of the critical infrastructure of extreme ultraviolet (EUV) lithography.

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