U.S. 300 mm Chip Manufacturer Selects EAGLEi 300 FOUP Inspection Technology for Production
(SHELLBACK Semiconductor Technology: Coopersburg, PA) -- SHELLBACK Semiconductor Technology, at the forefront of supplying capital equipment solutions to emerging semiconductor markets worldwide, has sold its popular EAGLEi 300 FOUP inspection system to a major 300 mm chip manufacturer in the U.S