3-D Solder Paste Inspection with Process Uplink FunctionMore than just defect detection
Mon, 04/16/2012 - 11:21
(Viscom: Hanover, Germany) -- In surface mount technology (SMT) electronic-assembly production, 3-D solder paste inspection (SPI) has established itself as the additional inspection gate to complement optical or X-ray inspection. The key task is…