(Viscom: Hanover, Germany) -- In surface mount technology (SMT) electronic-assembly production, 3-D solder paste inspection (SPI) has established itself as the additional inspection gate to complement optical or X-ray inspection. The key task is detecting impermissible printed pads in terms of volume, form, smearing, and offset. In addition to providing defect detection, the Viscom 3-D SPI can accomplish much more. The SPI-automated optical inspection (AOI) uplink function links paste inspection and post-reflow inspection results for both easy and effective process control as well as improved classification of AOI results. The functionality of the Viscom Process Uplink will be demonstrated live in stand No. 7-211 at the upcoming SMT Hybrid Packaging conference in Nuremberg, Germany.

The 3-D SPI is used to detect defects in paste print. Electronic assemblies that do not meet the specified criteria are already sorted out after the solder paste is printed. This is why the 3-D SPI has established itself as the standard by saving the unnecessary costs of reworking electronic assemblies, particularly in high-quality electronic products.

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