ChamberCam Measures Components Under Extreme Climatic ConditionsEnables users to obtain optical 3-D thermal expansion and displacement data
Wed, 06/13/2012 - 11:28
(DIS: Clinton Township, MI) -- Dynamic Intelligent Solutions (DIS) recently outfitted an automotive customer’s paint bake oven with ChamberCam, allowing the customer to obtain optical 3-D thermal expansion and displacement data of an aluminum roof… Measuring 3-D Dimensional Stability in Extreme Climatic ConditionsDynamic Intelligent Solutions takes first place in SAE auto innovation for ChamberCam
Tue, 11/22/2011 - 14:40
(DIS: Clinton Township, MI) -- Dynamic Intelligent Solutions (DIS) was awarded first place in the Great Lakes 4th Annual Automotive Innovation, which was sponsored by the Detroit chapter of the Society for Automotive Engineers (SAE) and the MIT… Dynamic Intelligent Solutions Launches ChamberCam for Hot SpotsPhotogrammetry and thermal technology enable measurement in temperature extremes
Wed, 06/15/2011 - 13:57
(DIS: Detroit) -- Dynamic Intelligent Solutions LLC (DIS) has launched its innovative, ChamberCam process, which provides dynamic, 3-D measurement of components under extreme climatic conditions.
The ChamberCam system combines photogrammetry… DIS Makes 3-D Measurement Possible In Climatic ExtremesReal-time 3-D scanning from extreme heat to extreme cold
Wed, 02/09/2011 - 12:02
(Dynamic Intelligent Solutions: Clinton Township, MI) -- The ability to pinpoint a product’s dimensional profile before and after exposure to temperature and humidity extremes is a standard testing practice, but the ability to measure a component’s… New System Allows 3-D Measurement of Components at Climatic ExtremesHelps manufacturers measure dimensional-stability components at high temperatures or in motion
Tue, 11/02/2010 - 17:38
(DIS: Novi, MI) -- Dynamic Intelligent Solutions LLC (DIS) has launched its patent-pending process, called “ChamberCam,” that more efficiently measures dimensional-stability components under extreme climatic conditions, reducing development time…
